TS991SNL500T3
- Manufacturer :
- Chip Quik Inc.
- Product Category :
- Solder
- Composition :
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Jar, 17.64 oz (500g)
- Melting Point :
- 423°F (217°C)
- Mesh Type :
- 3
- Process :
- Lead Free
- Product Status :
- Active
- Shelf Life :
- 12 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- -
- Type :
- Solder Paste
- Wire Gauge :
- -
- Datasheet :
- TS991SNL500T3
Manufacturer related products
Catalog related products
related products
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| TS991AX35T4 | Chip Quik Inc. | 3 | THERMALLY STABLE SOLDER PASTE NC |
| TS991AX500T4 | Chip Quik Inc. | 5,000 | SOLDER PASTE THERMALLY STABLE NC |
| TS991SNL35T3 | Chip Quik Inc. | 25 | THERMALLY STABLE SOLDER PASTE NC |
| TS991SNL35T4 | Chip Quik Inc. | 28 | THERMALLY STABLE SOLDER PASTE NC |
| TS991SNL500T4 | Chip Quik Inc. | 5,000 | SOLDER PASTE THERMALLY STABLE NC |
