SMD291SNL500T3C

Manufacturer
Chip Quik Inc.
Product Category
Solder
Description
SOLDER PASTE NO-CLEAN SAC305 T3
Manufacturer :
Chip Quik Inc.
Product Category :
Solder
Composition :
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter :
-
Flux Type :
No-Clean
Form :
Cartridge, 17.64 oz (500g)
Melting Point :
423 ~ 428°F (217 ~ 220°C)
Mesh Type :
3
Process :
Lead Free
Product Status :
Active
Shelf Life :
6 Months
Shelf Life Start :
Date of Manufacture
Storage/Refrigeration Temperature :
37°F ~ 46°F (3°C ~ 8°C)
Type :
Solder Paste
Wire Gauge :
-
Datasheet :
SMD291SNL500T3C

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