NC191LTA35
- Manufacturer :
- Chip Quik Inc.
- Product Category :
- Solder
- Composition :
- Bi57Sn42Ag1 (57/42/1)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Syringe, 1.23 oz (35g), 10cc
- Melting Point :
- 279°F (137°C)
- Mesh Type :
- 4
- Process :
- -
- Product Status :
- Active
- Shelf Life :
- 12 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 37°F ~ 46°F (3°C ~ 8°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
- Datasheet :
- NC191LTA35
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|---|---|---|---|
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| NC191LT10 | Chip Quik Inc. | 158 | SMOOTH FLOW LOW TEMP SOLDER PAST |
| NC191LT15 | Chip Quik Inc. | 21 | SMOOTH FLOW LOW TEMP SOLDER PAST |
