SMDSW.031 1LB
- Manufacturer :
- Chip Quik Inc.
- Product Category :
- Solder
- Composition :
- Sn63Pb37 (63/37)
- Diameter :
- 0.031" (0.79mm)
- Flux Type :
- No-Clean, Water Soluble
- Form :
- Spool, 1 lb (454 g)
- Melting Point :
- 361°F (183°C)
- Mesh Type :
- -
- Process :
- Leaded
- Product Status :
- Active
- Shelf Life :
- -
- Shelf Life Start :
- -
- Storage/Refrigeration Temperature :
- -
- Type :
- Wire Solder
- Wire Gauge :
- 20 AWG, 22 SWG
- Datasheet :
- SMDSW.031 1LB
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| SMDST2CC4 | Chip Quik Inc. | 11 | TACK FLUX IN 2CC SQUEEZE TUBES S |
| SMDSW.015 100G | Chip Quik Inc. | 22 | SOLDER WIRE 63/37 TIN/LEAD NO-CL |
| SMDSW.020 1LB | Chip Quik Inc. | 11 | SOLDER WIRE 63/37 TIN/LEAD NO-CL |
| SMDSW.020 1OZ | Chip Quik Inc. | 14 | SOLDER WIRE NO-CLEAN 63/37 1OZ. |
| SMDSW.020 2OZ | Chip Quik Inc. | 7 | SOLDER WIRE NO-CLEAN 63/37 2OZ. |
| SMDSW.020 4OZ | Chip Quik Inc. | 43 | SOLDER WIRE NO-CLEAN 63/37 4OZ. |
| SMDSW.020 8OZ | Chip Quik Inc. | 11 | SOLDER WIRE 63/37 TIN/LEAD NO-CL |
| SMDSW.031 1OZ | Chip Quik Inc. | 11 | SOLDER WIRE NO-CLEAN 63/37 1OZ. |
| SMDSW.031 2OZ | Chip Quik Inc. | 45 | SOLDER WIRE NO-CLEAN 63/37 2OZ. |
| SMDSW.031 4OZ | Chip Quik Inc. | 23 | SOLDER WIRE NO-CLEAN 63/37 4OZ. |
