- Manufacturer:
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- CUI Devices (1)
- Type:
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- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|---|
CTS Thermal Management Products | HEATSINK FORGED ... |
|
300 |
5,000
In-stock
|
Buy Now Get Quote | |||
CTS Thermal Management Products | HEATSINK FORGED ... |
|
300 |
5,000
In-stock
|
Buy Now Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
|
1,500 |
5,000
In-stock
|
Buy Now Get Quote |