- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
1,000 |
5,000
In-stock
|
Buy Now Get Quote | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
1,000 |
5,000
In-stock
|
Buy Now Get Quote | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
2,500 |
5,000
In-stock
|
Buy Now Get Quote | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
3,500 |
5,000
In-stock
|
Buy Now Get Quote | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEAT SINK |
|
1 |
572
In-stock
|
Buy Now Get Quote |
