- Manufacturer：
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- CUI Devices (1)
- Wakefield-Vette (3)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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10 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEATSINK 21X12MM D... |
|
1 |
5
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK 27X27X7.5M... |
|
10 |
5,000
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 40MM X 30... |
|
1 |
9
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 40MM X 30... |
|
1 |
23
In-stock
|
Buy Now Get Quote | ||
|
|
Wakefield-Vette | HEATSINK 21X12MM F... |
|
1 |
66
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 27MM X 27... |
|
1 |
221
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions Inc. | SUPERGRIP HEATSI... |
|
1 |
66
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 27MM X 27... |
|
1 |
175
In-stock
|
Buy Now Get Quote | ||
|
|
Wakefield-Vette | HEATSINK 21X12MM S... |
|
1 |
446
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
1 |
2,908
In-stock
|
Buy Now Get Quote |
