- Manufacturer：
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- CUI Devices (2)
- Material：
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- Length：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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6 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
1,380 |
5,000
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
1,380 |
5,000
In-stock
|
Buy Now Get Quote | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
|
1 |
32
In-stock
|
Buy Now Get Quote | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
|
1 |
517
In-stock
|
Buy Now Get Quote | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
|
1 |
228
In-stock
|
Buy Now Get Quote | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
|
1 |
1,275
In-stock
|
Buy Now Get Quote |
