- Manufacturer:
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- CUI Devices (1)
- Product Status:
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- Material:
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- Diameter:
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- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Material Finish:
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6 Records
Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|---|
CTS Thermal Management Products | THERMAL LINK PRE... |
|
100 |
5,000
In-stock
|
Buy Now Get Quote | |||
CTS Thermal Management Products | THERMAL LINK PRE... |
|
100 |
5,000
In-stock
|
Buy Now Get Quote | |||
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
5,000 |
5,000
In-stock
|
Buy Now Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
|
1 |
1,974
In-stock
|
Buy Now Get Quote | |||
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 TA... |
|
1 |
2,269
In-stock
|
Buy Now Get Quote | |||
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 FO... |
|
1 |
9,656
In-stock
|
Buy Now Get Quote |