- Manufacturer:
-
- Comair Rotron (1)
- CUI Devices (1)
- Product Status:
-
- Material:
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- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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2 Records
Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|---|
Comair Rotron | HEATSINK STAMP 22... |
-
|
1 |
5,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
|
1 |
5,000
In-stock
|
Buy Now Get Quote |