- Manufacturer：
-
- Comair Rotron (1)
- CUI Devices (1)
- Wakefield-Vette (1)
- Product Status：
-
- Type：
-
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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6 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEATSINK SMT PKG |
-
|
1 |
5,000
In-stock
|
Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 19... |
-
|
1 |
5,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
|
150 |
300
In-stock
|
Buy Now Get Quote | ||
|
|
Assmann WSW Components | HEATSINK TO-263 19.3... |
|
1 |
394
In-stock
|
Buy Now Get Quote | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-263 (D2... |
|
1 |
6,052
In-stock
|
Buy Now Get Quote | ||
|
|
Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSI... |
|
1 |
13,140
In-stock
|
Buy Now Get Quote |
