- Manufacturer：
-
- Comair Rotron (1)
- CUI Devices (1)
- Product Status：
-
- Type：
-
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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4 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK TO-263 CO... |
|
9,000 |
5,000
In-stock
|
Buy Now Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 25... |
-
|
1 |
5,000
In-stock
|
Get Quote | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
1,000 |
5,000
In-stock
|
Buy Now Get Quote | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
1 |
5,682
In-stock
|
Buy Now Get Quote |
