- Manufacturer：
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- CUI Devices (2)
- Ohmite (13)
- Wakefield-Vette (9)
- Product Status：
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- Material：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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26 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEATSINK TO247 W/C... |
|
1 |
173
In-stock
|
Buy Now Get Quote | ||
|
|
Wakefield-Vette | HEATSINK TO220 W/C... |
|
1 |
173
In-stock
|
Buy Now Get Quote | ||
|
|
Wakefield-Vette | HEATSINK TO126 W/C... |
|
1 |
226
In-stock
|
Buy Now Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
|
1 |
5,000
In-stock
|
Buy Now Get Quote | ||
|
|
Assmann WSW Components | HEATSINK TO-220/TO... |
|
1 |
1,067
In-stock
|
Buy Now Get Quote | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
|
1 |
1,275
In-stock
|
Buy Now Get Quote |
