- Manufacturer：
-
- CUI Devices (1)
- Material：
-
- Attachment Method：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
2 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 9.8W... |
|
5,400 |
5,000
In-stock
|
Buy Now Get Quote | ||
|
|
t-Global Technology | CERAMIC HEAT SPR... |
|
1 |
195
In-stock
|
Buy Now Get Quote |
