- Manufacturer：
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- Cooling Source (2)
- CUI Devices (1)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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3 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|---|
|
Cooling Source | 28.5X28.5X10MM |
|
1 |
13
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 28.... |
|
1 |
1,728
In-stock
|
Buy Now Get Quote | ||
|
|
Cooling Source | 28.5X28.5X10MM |
|
1 |
950
In-stock
|
Buy Now Get Quote |
