- Manufacturer：
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- CUI Devices (3)
- Length：
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- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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7 Records
| Image | Part | Manufacturer | Description | Price | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
10,000 |
5,000
In-stock
|
Buy Now Get Quote | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
|
12,000 |
5,000
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
|
10,000 |
5,000
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
|
10,000 |
5,000
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
|
10,000 |
5,000
In-stock
|
Buy Now Get Quote | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-5 .5" B... |
|
10,000 |
5,000
In-stock
|
Buy Now Get Quote | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-5 .75" B... |
|
1 |
1,637
In-stock
|
Buy Now Get Quote |
